PCB Layout

TouchPad’s PCB layout group provides electronic packaging, design and simulation services using the latest advanced EDA toolsets and highly skilled professional designers. TouchPad serves many of the industry leaders in medical, commercial, industrial, consumer, and some of the world’s most advanced research organizations.

PCB layout

Tool Platforms

  • Cadence Design Systems- Allegro/OrCAD Capture/OrCAD layout
  • Cadence Concept HDL
  • Altium Designer
  • Mentor Graphics- PADS Logic and DX Designer for PADS Layout


  • Standard Printed Circuit Board layout with no limit to layer configurations
  • Sequential lamination, Blind/Buried vias, Skip Drilling, Buried Capacitance, Micro-Vias, HDI, Impedance Control, and High Speed Digital designs to MGHz+ on FR4 and advanced high performance material
  • Chip-on-Board, Multi-Chip Modules, Die Attach
  • Pre-layout thermal planning & stack-up definition, controlled stack development and multi-layer aluminum & other metallic PCB’s
  • High-speed digital designs to GHz + on FR4 and high performance materials
  • Pre-layout simulation and analysis services, EMC/EMI and SI analyses software platforms
  • Termination and topology strategies
  • Stack-up and impedance analysis
  • Post-layout simulation and analysis verification
  • DFM reports and feedback on design
  • Low-Loss Materials, Metal Cores, Heat Plates

Areas of Expertise

  • Memory, DVI, Ethernet, USB2/3, PCI, PCI-X, all current DIMM DDR memory platforms
  • RF Signal Design/RF Antenna Design
  • Backplane/Frontplane Design
  • Single and Multi-Layer MCPCB (Metal Core PCB)
  • High-end constraint driven designs

Flexible Printed Circuit and Rigid-Flex Design

TouchPad Electronics has expert FPC design specialists that can take your drawing from a schematic sketch and basic FPC outline to produce CAD files and drawings to produce outputs. We can point out cost drivers as well as material selection to help your team make critical decisions up front to save on production costs down the line. From single layer to multi-layer FPC, TouchPad can take on any flex design project.

Finally, TouchPad can complete the FPC design, panelize for assembly and advise tooling for manufacturing. Once our designers are complete with your project, we can build your assemblies in our facility for test.

Flexible Printed Circuit Design
  • Initial Schematic reviews to estimate layer counts
  • Determine conductor widths per Namograph for high current FPC’s
  • Advise overall thicknesses, materials, cover layers and construction
  • Review mechanical requirements of proposals and generate dummy models for fitment made from PET or other materials to represent final FPC behaviors

Flexible Printed Circuit Manufacturing

TouchPad is a leader in quick-turn & Rigid FPC. We offer solutions for high quality product coupled with dedicated customer service. DFM & cost reduction reports are standard with every order. We will advise on improvements to the design ways to cut cost on future production runs. We assure the highest quality prototypes at unmatched speed, low cost NRE and piece price.

Flexible Printed Circuit Manufacturing

Flexible Printed Circuit Assembly

Whether we are assembling one connector or a densely populated rigid FPC, TouchPad is experienced with a wide variety of polyimide and Kapton materials. We have the experience necessary to make your FPC assembly flow smoothly through the assembly process. We have in-house pallet and fixture fabrication, high-speed BGA and uBGA placement equipment, and a strict product flow for assembly from kitting to final inspection and test.

Flexible Printed Circuit Assembly

Membrane Switch Design

TouchPad has the ability to take on any of your membrane switch design projects. We have extensive experience with a wide variety of materials, stack-ups, and layer configurations. We specialize in membrane hybrid circuit technologies, and are experts at designing in Duraswitch patented technologies such as PushGate, Peel and Place, thiNcoder RT, and MagnaMouse PIC controller and joystick. TouchPad is a Duraswitch authorized design organization.


Since membrane switches are custom designed to meet specific applications, each product will have its own criteria to meet. There are, however, certain parameters which could be of value in enhancing appearance, improving reliability and reducing cost.

Ideally, the membrane switch will be designed simultaneously with the product on which it will be used. Too often, keyboards are the last component designed and must dovetail into a case in size and contents are already fixed and critical. Such constraints may inhibit the optimum design which other wise might have been available.

Since it is our goal to produce the best possible product for the lowest cost, we offer the following suggestions for your design considerations.


  • What temperature and humidity ranges will this product experience?
  • What types of contaminants or solvents will come into contact with this product?
  • Will this product be used indoors or outdoors & exposed to the elements?

Mechanical Membrane Switch

  • Will tactile response be required?
  • To what material will the switch be laminated?
  • What number of actuations will the product receive?
  • Will actuation force be a factor?


  • How many switches will there be?
  • What type of pinout will be used? (common bus, X-Y matrix, or other)
  • What closed loop resistance will be acceptable?
  • Will electrostatics or EMI shielding be necessary?


  • Will edges be exposed, recessed, or covered by a bezel?
  • Will embossing be required?
  • Will there be different parts to the same product? (sets)

Basic Layout and Tolerances

  • Edge clearance – Keypads should be a minimum of 0.500” from the edge of the switch panel.
  • Allow at least 0.125” spacing between keypads or printed circuitry to the edge of a window or cutout.
  • Avoid too many keypads in too small an area. Keypads smaller than 0.375” diameter will be awkward to operate, as well as requiring a higher actuation force.


  • Steel rule dies normally achieve a tolerance of ± 0.010” when cutting material up to 0.025” in thickness. When cutting material over 0.030”, steel rule dies will lose their accuracy and sharpness, making close registration die cutting more difficult.
  • Hard tooling (male/female punch dies) can achieve a tolerance of ± 0.002”. However, cost is significantly greater than steel rule dies. On short runs, laser cutting can save money.

Electrical Layout and Specifications

  • A pinout and/or schematic for a common bus, X-Y matrix, or combinatorial matrix can be supplied, or TouchPad can design it for you.
  • Closed loop resistance is normally between 20 and 100 ohms.
  • Switches are usually rated to carry no more than 50mA. The power rating (current * voltage) should be kept below 1.5 watts. Materials – Graphic Overlay Types of material:
    Polycarbonate (Lexan)……..005” – .030” thick
    Polyester (Mylar)…………….005” – .010” thick