By 2023, our team grew to over 50, then to 60 in 2024, and nearly 70 members in 2025, all aligned toward mastering the most complex board assemblies in the industry. Since 2023, we signed several three-way NDAs with customers and their chip manufacturing partners, collaborating to develop datasheets for processing standards and best practices. In addition, we have done the same with GCMs to enable the flow of information across each of the program stakeholders. To support the growing demands, in 2024 and 2025 we made back-to-back multi-million-dollar investments in upgraded, cutting-edge 3D optical inspection equipment, advanced flex placement equipment, and state-of-the-art printing and reflow systems, much of which is considered best-in-industry. Renowned for our ability to solve complex engineering challenges, we’ve worked tirelessly to streamline R&D-to-production transfers, both internally and for GCMs worldwide.
Quick-Turn PCB assembly
