Quick Turn Dev Builds

Intelligent, Transparent Practices

Intelligent, transparent practices drive NPI/NPD hardware development process.

Our team understands that programs have challenges that impact domestic & global EMS supply chain. We can’t serve every program from cradle to grave. We provide lessons learned, best practices & highlight concerns during builds.

Intelligent, Transparent Practices

Intelligent, transparent practices drive NPI/NPD hardware development process.

Our team understands that programs have challenges that impact domestic & global EMS supply chain. We can’t serve every program from cradle to grave. We provide lessons learned, best practices & highlight concerns during builds.

Smooth Path to Market

Supply chain teams are too often left cleaning up the mess. Our processes enable smoother transfers to volume manufacturing, delivering faster first-pass yield and a shorter path to market.

Initial Alpha/Beta Runs:

  • Preemptive establishment of PCB stack, material selection, via structure & processing procedures across an appropriate vendor base to ensure future success for Supply Chain
  • In-depth dive into all custom material requirements and establishment of initial supply chain concerns and vetting
  • Manufacturing requirements & data reviews for each build
  • Program schedule, milestones and resources planning
  • 3D “virtual build” to vet footprint & pad data against component datasheet requirements, and highlight any preliminary manufacturing concerns
  • Reviews of component lifecycle, lead time & other concerns

Preparation for Volume:

  • Historical build review, ensuring that all recommended design changes are implemented, or mitigated
  • Process work instructions including MSL life definitions, handling, thermal, moisture, installation or other process concerns for sensitive components by BOM line
  • Test documentation based on documentation & fixturing designed during product development phases
  • Proven stencil aperture design files which achieve volume requirements per datasheets / IPC inspection class released
  • PPAP to Level III for board fabrication & assembly processes
  • Define “areas of concern” and component & product CTQs

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